package Information
-
BGA(ball grid array )
-
PGA(butt joint pin grid array)
-
BQFP(quad flat package with bumper)
-
PGA(butt joint pin grid array)
-
CLCC(ceramic leaded chip carrier)
-
COB(chip on board)
-
DFP(dual flat package)
-
DSO(dual small out-lint)
-
DICP(dual tape carrier package)
-
DIP(dual tape carrier package)
-
FQFP(fine pitch quad flat package)
-
CPAC(globe top pad array carrier)
-
CQFP(quad fiat package with guard ring)
-
JLCC(J-leaded chip carrier)
-
LCC(Leadless chip carrier)
-
LGA(land grid array)
-
LQFP(low profile quad flat package)
-
MCM(multi-chip module
-
MFP(mini flat package
-
MQFP(metric quad flat package)
-
MSP(mini square package)
-
OPMAC(over molded pad array carrier)
-
PCLP(printed circuit board leadless package)
-
PFPF(plastic flat package)
-
PGA(pin grid array)
-
PLCC(plastic teadless chip carrier)(plastic leaded chip currier)
-
QFH(quad flat high package)
-
QFI(quad flat I-leaded packgac)
-
QFJ(quad flat J-leaded package)
-
QFN(quad flat non-leaded package)
-
QFP(quad flat package)
-
QIC(quad in-line ceramic package)
-
QTCP(quad tape carrier package)
-
QTP(quad tape carrier package
-
SDIP (shrink dual in-line package)
-
SH－DIP(shrink dual in-line package)
-
SMD(surface mount devices)
-
SOI(small out-line I-leaded package)
-
SOIC(small out-line integrated circuit)
-
SOJ(Small Out-Line J-Leaded Package
-
SQL(Small Out-Line L-leaded package)
-
SONF(Small Out-Line Non-Fin)
-
SOF(small Out-Line package)
-
SOW (Small Outline Package(Wide-Jype))
