封装信息
- BGA(ball grid array )
- PGA(butt joint pin grid array)
- BQFP(quad flat package with bumper)
- PGA(butt joint pin grid array)
- CLCC(ceramic leaded chip carrier)
- COB(chip on board)
- DFP(dual flat package)
- DSO(dual small out-lint)
- DICP(dual tape carrier package)
- DIP(dual tape carrier package)
- FQFP(fine pitch quad flat package)
- CPAC(globe top pad array carrier)
- CQFP(quad fiat package with guard ring)
- JLCC(J-leaded chip carrier)
- LCC(Leadless chip carrier)
- LGA(land grid array)
- LQFP(low profile quad flat package)
- MCM(multi-chip module
- MFP(mini flat package
- MQFP(metric quad flat package)
- MSP(mini square package)
- OPMAC(over molded pad array carrier)
- PCLP(printed circuit board leadless package)
- PFPF(plastic flat package)
- PGA(pin grid array)
- PLCC(plastic teadless chip carrier)(plastic leaded chip currier)
- QFH(quad flat high package)
- QFI(quad flat I-leaded packgac)
- QFJ(quad flat J-leaded package)
- QFN(quad flat non-leaded package)
- QFP(quad flat package)
- QIC(quad in-line ceramic package)
- QTCP(quad tape carrier package)
- QTP(quad tape carrier package
- SDIP (shrink dual in-line package)
- SH－DIP(shrink dual in-line package)
- SMD(surface mount devices)
- SOI(small out-line I-leaded package)
- SOIC(small out-line integrated circuit)
- SOJ(Small Out-Line J-Leaded Package
- SQL(Small Out-Line L-leaded package)
- SONF(Small Out-Line Non-Fin)
- SOF(small Out-Line package)
- SOW (Small Outline Package(Wide-Jype))
